Category: Uncategorized
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Thin Films This Week — May 22, 2026
Intel 18A yields improve 7–8% monthly, EVG demos hybrid bonding at ECTC 2026, and Samsung’s GAA yield gap persists despite averted strike.
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Thin Films This Week — May 15, 2026
A process engineer’s take on the week’s biggest semiconductor news: Intel 18A-P Apple testing, display makers entering glass interposer packaging, and TSMC’s N2 ramp.
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Thin Films This Week — May 08, 2026
TSMC guts Fab 15A’s deposition line for 4nm, NVIDIA/Corning bet on optical interconnects, and SK Hynix’s HBM capacity crisis is really an advanced packaging deposition bottleneck.
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Thin Films This Week — May 1, 2026
Story 1: Intel Details 18A-P — 50% Thermal Conductivity Improvement Via New Contact and Interconnect Films 📰 What happened: Intel published a paper at VLSI 2026 detailing its 18A-P process…