Category: Uncategorized

Fab Floor Briefing: Intel 14A defect learning is the best since 22nm, SK hynix breaks ground on its Indiana HBM base, and Kioxia and SanDisk commit $31 billion to Japan…

Three stories this week, and each one is really about who controls the films. Intel 18A-P lands Socionext, Samsung pushes HBM base dies to 2nm, and China’s AMEC triples etch…

Applied Materials’ record quarter, TSMC’s 98% CoWoS-L yield, and Samsung’s 80% golden yield on HBM4. Three headlines that are really thin films stories.

TSMC N2 wafers hit $30K and book to 2028, NYCU and TSMC crack the 2D gate stack with an epitaxial AlOx buffer, and Entegris confirms the consumables ramp.

Three stories from the cleanroom side: Washington’s $300M silicon photonics bet, CPO entering volume ramp, and TEL’s record quarter says memory film stacks keep growing.

TSMC adds $100B to Arizona, AMD ships first 2nm HPC silicon on N2, and Intel 18A yield breaks 80% — a process engineer’s take on the thin films that made…

Intel ships first High NA EUV production wafers, TSMC and Samsung hike prices 5-15% on advanced nodes, and TSMC’s A14 process accelerates past N2 milestones — a thin films and…

1. Glass Substrates Cross the Inflection Point — CoWoS Cost Surge Accelerates the Tectonic Shift What happened: TrendForce published a landmark…

Samsung ships first HBM4E 12-layer samples with hybrid bonding, Intel invests $3.3B in glass core substrates in India, and TSMC COUPE silicon photonics enters volume production.